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Proceedings Paper

Planar latch-up microactuator driven by thermoelastic force
Author(s): Jong-Hyun Lee; Myung-Lae Lee; Won-Ick Jang; Chang-Auck Choi; Youn Tae Kim
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Paper Abstract

We designed and fabricated a planar-type thermoelastic microactuator with a latch-up operation for optical switching. Latch-up actuation is prerequisite to implement an optical switch with low power consumption and high reliability. The proposed microactuator consists of four cantilever-shaped thermal actuators, four displacement linkages, two shallow arch-shaped leaf springs, a mobile shuttle mass with a micromirror, and four elastic boundaries. The planar microactuator consists of phosphorous-doped 12 micrometers -thick polysilicon as a structural layer and LTO (Low Temperature Oxide) of 3 micrometers thickness as a sacrificial layer on polysilicon substrate. The experimental displacement of the microactuator was more than 21 micrometers at 10V input voltage for the prototype of a thermoelastic microactuator. The frequency response for square wave input was measured up to 50Hz, which was the highest frequency we can detect using optical microscope for now. The proposed microactuators have advantages of easy assembly with other optical component by way of fiber alignment in the substrate plane, and its fabrication process features simplicity while retaining batch-fabrication economy.

Paper Details

Date Published: 15 August 2000
PDF: 8 pages
Proc. SPIE 4176, Micromachined Devices and Components VI, (15 August 2000); doi: 10.1117/12.395638
Show Author Affiliations
Jong-Hyun Lee, Electronics and Telecommunications Research Institute (South Korea)
Myung-Lae Lee, Electronics and Telecommunications Research Institute (South Korea)
Won-Ick Jang, Electronics and Telecommunications Research Institute (South Korea)
Chang-Auck Choi, Electronics and Telecommunications Research Institute (South Korea)
Youn Tae Kim, Electronics and Telecommunications Research Institute (South Korea)


Published in SPIE Proceedings Vol. 4176:
Micromachined Devices and Components VI
Eric Peeters; Oliver Paul, Editor(s)

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