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Proceedings Paper

Nano-spring arrays for high-density interconnect
Author(s): David K. Fork; Christopher L. Chua; Patrick Kim; Linda T. Romano; Rachel Lau; Lai Wong; Andrew Alimonda; Vicki Geluz; Mark Teepe; Joe Haemer; Mitul B. Modi; Qi Zhu; Dennis L. Ma; Suresh Sitaraman; Donald L. Smith; Sammy Mok
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Paper Abstract

A new type of compliant interconnect derived from a thin metal film fabricated with a controlled stress profile is being developed for flip- flop interconnects and probing devices. Interconnections have been demonstrated on lateral pitches as tight as 6 microns. The interconnect is highly elastic and can provide up to hundreds of microns of vertical compliance.

Paper Details

Date Published: 15 August 2000
PDF: 10 pages
Proc. SPIE 4176, Micromachined Devices and Components VI, (15 August 2000); doi: 10.1117/12.395634
Show Author Affiliations
David K. Fork, Xerox Palo Alto Research Ctr. (United States)
Christopher L. Chua, Xerox Palo Alto Research Ctr. (United States)
Patrick Kim, Xerox Palo Alto Research Ctr. (United States)
Linda T. Romano, Xerox Palo Alto Research Ctr. (United States)
Rachel Lau, Xerox Palo Alto Research Ctr. (United States)
Lai Wong, Xerox Palo Alto Research Ctr. (United States)
Andrew Alimonda, Xerox Palo Alto Research Ctr. (United States)
Vicki Geluz, Xerox Palo Alto Research Ctr. (United States)
Mark Teepe, Xerox Palo Alto Research Ctr. (United States)
Joe Haemer, Georgia Institute of Technology (United States)
Mitul B. Modi, Georgia Institute of Technology (United States)
Qi Zhu, Georgia Institute of Technology (United States)
Dennis L. Ma, Georgia Institute of Technology (United States)
Suresh Sitaraman, Georgia Institute of Technology (United States)
Donald L. Smith, NanoNexus Inc. (United States)
Sammy Mok, NanoNexus Inc. (United States)


Published in SPIE Proceedings Vol. 4176:
Micromachined Devices and Components VI
Eric Peeters; Oliver Paul, Editor(s)

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