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Proceedings Paper

Bulk micromachining for sensors and actuators
Author(s): Masayoshi Esashi
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Paper Abstract

Silicon bulk micromachining which is based on a silicon etching and a glass-silicon anodic bonding plays important roles to make micro sensors and micro actuators. Three dimensional microfabrication of other functional materials as piezoelectric materials are also important to develop high performance microactuators, micro energy source and so on. Vacuum sealing is required to prevent a viscous dumping for packages micromechanical sensors. Extremely small structures as microprobe are required for high resolution, high sensitivity and quick response. As sophisticated microsystems which are made of many sensors, circuits and actuators are required for example for maintenance tools used in a narrow space. Developments for those required will be described.

Paper Details

Date Published: 15 August 2000
PDF: 10 pages
Proc. SPIE 4176, Micromachined Devices and Components VI, (15 August 2000); doi: 10.1117/12.395630
Show Author Affiliations
Masayoshi Esashi, Tohoku Univ. (Japan)


Published in SPIE Proceedings Vol. 4176:
Micromachined Devices and Components VI
Eric Peeters; Oliver Paul, Editor(s)

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