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Proceedings Paper

Passive alignment and its application in multilevel x-ray lithography
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Paper Abstract

Many MEMS applications require multi-level microstructures in which two or more levels have to be aligned to each other in the processing. In this paper a passive alignment system based on a mechanical registration method utilizing reference posts is described. A detailed analysis of the test results was conducted to reveal main error sources and estimate the accuracy of this alignment method. An alignment accuracy of +/- 5(mu) m between 2 layers has been achieved. The further work on improving the alignment accuracy and expending in this alignment method to graphite masks for multi-level X-ray or combined optical/x-ray lithography is proposed.

Paper Details

Date Published: 11 August 2000
PDF: 7 pages
Proc. SPIE 4175, Materials and Device Characterization in Micromachining III, (11 August 2000); doi: 10.1117/12.395611
Show Author Affiliations
Zhong Geng Ling, Louisiana State Univ. (United States)
Kun Lian, Louisiana State Univ. (United States)
Jost Goettert, Louisiana State Univ. (United States)


Published in SPIE Proceedings Vol. 4175:
Materials and Device Characterization in Micromachining III
Yuli Vladimirsky; Philip J. Coane, Editor(s)

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