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Proceedings Paper

Finite-element analysis of solder joint strength in laser diode packaging
Author(s): Chi-Hsiung Chang; Maw-Tyan Sheen; Jao-Hwa Kuang; Chi-Chen Chen; Gol-Lin Wang; Wood-Hi Cheng; Hung-Lon Chang; Szu-Chun Wang; Chungyung Wang; Chih-Ming Wang
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Paper Abstract

The effect of PbSn solder joint strength on temperature tests in laser diode packaging has been studied experimentally and numerically. It was found that the solder joint strength increased as temperature cycle number increased. A finite-element method (FEM) analysis is performed on the calculation of joint strength of PbSn solder in temperature cycling tests for laser diode packaging. Numerical calculations were in good agreement with the experimental measurements that the solder joint strength increased as the temperature cycle increased. This is may be due to the redistribution of the residual stresses within the solder during the temperature cycling tests, and hence reducing the residual stresses and increasing the solder joint strength as the temperature cycle number increased. The result suggests that the FEM is an effective method for predicting the solder joint strength in laser diode packages.

Paper Details

Date Published: 11 July 2000
PDF: 6 pages
Proc. SPIE 4078, Optoelectronic Materials and Devices II, (11 July 2000); doi: 10.1117/12.392199
Show Author Affiliations
Chi-Hsiung Chang, National Sun Yat-sen Univ. (Taiwan)
Maw-Tyan Sheen, National Sun Yat-sen Univ. (Taiwan)
Jao-Hwa Kuang, National Sun Yat-sen Univ. (Taiwan)
Chi-Chen Chen, National Sun Yat-sen Univ. (Taiwan)
Gol-Lin Wang, National Sun Yat-sen Univ. (Taiwan)
Wood-Hi Cheng, National Sun Yat-sen Univ. (Taiwan)
Hung-Lon Chang, Chunghwa Telecom Labs. (Taiwan)
Szu-Chun Wang, Chunghwa Telecom Labs. (Taiwan)
Chungyung Wang, Chunghwa Telecom Labs. (Taiwan)
Chih-Ming Wang, Chunghwa Telecom Labs. (Taiwan)


Published in SPIE Proceedings Vol. 4078:
Optoelectronic Materials and Devices II
Yan-Kuin Su; Pallab Bhattacharya, Editor(s)

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