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Proceedings Paper

Reticle inspection system using DUV wavelength and new alogorithm platform for advanced reticle inspection for 0.13-um technology node
Author(s): David S. Alles; Paul Terbeek; Shauh-Teh Juang; James N. Wiley; Kangmin Hsia
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Paper Abstract

KLA-Tencor has developed a fourth-generation reticle inspection system, the KLA-Tencor 570, using DUV imaging to detect 100-nm defects on advanced OPC and PSM reticles for the 0.13 micron technology node production and 0.10 micron technology development. This system contains innovations in optics, electronics, mechanics, algorithms, and software. The DUV wavelength of the optical system improves the resolution and thus the minimum linewidth capability. A low- noise optical system generates high-quality images to improve productivity, facilitate defect classification, and reduce operator errors. The United Inspection Computer (UIC), a high-speed scalable computational engine, renders database data to create an image of the mask for die-to- database inspections. The UIC uses the new Ultra-Performance Algorithm, which provides high detection sensitivity at high speed for D:D and D:DB inspections. UPA can handle complex structures such as advanced OPC and phase shift mask. TI places no fundamental requirement on the size of OPC features. UPA classified defects automatically. The operator can select sensitivity settings independently for each defect type. Since UPA measures the CD of every feature on the reticle, it can also make total plate quality measurements for statistical process control of mask manufacturing. A new reticle handling system reduces overhead time and allows easy loading and unloading of the reticle. This system manipulates 6-inch and 230-mm reticles with and without pellicles. A flexible adapter design allows the system to mix different reticle sizes. A new data preparation system executes on a multi-processor computer with a 64-bit operating system to minimize data preparation time. This DPS architecture allows the operator to change various inspection parameters such as pixel size, alignment points, DNIR's and rotation without the need for re-prep, thereby improving productivity and flexibility. The KLA- Tencor 570 also allows optional remote Data Prep. Test results indicate that the KLA-Tencor 570 already meets its sensitivity specifications on a Verimask VT 690 in both die- to-die and die-to-database modes.

Paper Details

Date Published: 19 July 2000
PDF: 10 pages
Proc. SPIE 4066, Photomask and Next-Generation Lithography Mask Technology VII, (19 July 2000); doi: 10.1117/12.392087
Show Author Affiliations
David S. Alles, KLA-Tencor Corp. (United States)
Paul Terbeek, KLA-Tencor Corp. (United States)
Shauh-Teh Juang, KLA-Tencor Corp. (United States)
James N. Wiley, KLA-Tencor Corp. (United States)
Kangmin Hsia, Intel Corp. (United States)

Published in SPIE Proceedings Vol. 4066:
Photomask and Next-Generation Lithography Mask Technology VII
Hiroaki Morimoto, Editor(s)

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