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Proceedings Paper

Assessing polylayer performance of UV defect detection systems
Author(s): James A. Reynolds
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Paper Abstract

Integrated circuit (IC) production is dependent on the ability of semiconductor manufacturers to obtain reticles which are free of printable defects. One key step in making such reticles is defect inspection. This process has two steps; locating reticle defects with an inspection system and classifying them accurately. Both techniques have been in place for many years, but the ability to assess the combined reliability of the scanning and classification procedures has not because of the pattern simplicity and defect predictability in most test reticles. To better evaluate the accuracy of scanning and classification, a new test reticle was designed with the line-widths, the complex geometries and the look-and-feel of a real-world, state-of- the-art, poly layer reticle. Programmed defects were place at varying locations in the native pattern to emulate more closely production reticle inspection. This poly defect test reticle was inspection in state-of-the-art mask facilities using three different advanced ultra violet reticle defect inspection systems and then classified by experienced personnel. The observed classification accuracy was high but inconclusive. The most significant result from this work was that there are large differences in defect scanning sensitivity between the three systems checked.

Paper Details

Date Published: 19 July 2000
PDF: 6 pages
Proc. SPIE 4066, Photomask and Next-Generation Lithography Mask Technology VII, (19 July 2000); doi: 10.1117/12.392085
Show Author Affiliations
James A. Reynolds, Reynolds Consulting (United States)


Published in SPIE Proceedings Vol. 4066:
Photomask and Next-Generation Lithography Mask Technology VII
Hiroaki Morimoto, Editor(s)

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