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Proceedings Paper

Characteristics of CD measurement equipment
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Paper Abstract

Shrinking device design rule, lithography requires more rigid CD accuracy on a mask. In most cases, cross sectional profiles are not uniformed on a chromium mask. Cross sectional profiles influence not only CD value but also aerial image on wafer. Suitable CD value for lithography is the same influenced one as aerial image. Therefore we studied this influence, and evaluated which CD value is suitable for lithography. As our results, CD result of DUV microscope is most suitable for 0.13 and 0.15 micrometers lithography.

Paper Details

Date Published: 19 July 2000
PDF: 6 pages
Proc. SPIE 4066, Photomask and Next-Generation Lithography Mask Technology VII, (19 July 2000); doi: 10.1117/12.392074
Show Author Affiliations
Takeshi Yamane, Toshiba Corp. (Japan)
Takashi Hirano, Toshiba Corp. (Japan)


Published in SPIE Proceedings Vol. 4066:
Photomask and Next-Generation Lithography Mask Technology VII
Hiroaki Morimoto, Editor(s)

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