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Proceedings Paper

150-nm DR contact holes die-to-database inspection
Author(s): Shen Chung Kuo; Clare Wu; Yair Eran; Wolfgang Staud; Shirley Hemar; Ofer Lindman
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Paper Abstract

Using a failure analysis-driven yield enhancements concept, based on an optimization of the mask manufacturing process and UV reticle inspection is studied and shown to improve the contact layer quality. This is achieved by relating various manufacturing processes to very fine tuned contact defect detection. In this way, selecting an optimized manufacturing process with fine-tuned inspection setup is achieved in a controlled manner. This paper presents a study, performed on a specially designed test reticle, which simulates production contact layers of design rule 250nm, 180nm and 150nm. This paper focuses on the use of advanced UV reticle inspection techniques as part of the process optimization cycle. Current inspection equipment uses traditional and insufficient methods of small contact-hole inspection and review.

Paper Details

Date Published: 19 July 2000
PDF: 9 pages
Proc. SPIE 4066, Photomask and Next-Generation Lithography Mask Technology VII, (19 July 2000); doi: 10.1117/12.392072
Show Author Affiliations
Shen Chung Kuo, Taiwan Mask Corp. (Taiwan)
Clare Wu, Applied Materials (Taiwan)
Yair Eran, Applied Materials (Israel)
Wolfgang Staud, Applied Materials (United States)
Shirley Hemar, Applied Materials (Israel)
Ofer Lindman, Applied Materials (United States)

Published in SPIE Proceedings Vol. 4066:
Photomask and Next-Generation Lithography Mask Technology VII
Hiroaki Morimoto, Editor(s)

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