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Proceedings Paper

Structural and thickness distribution evaluation of a multilayer photomask blank with x-ray reflectivity method
Author(s): Teruyoshi Hirano; Hiroshi Wada; Masao Otaki; Ryuji Matsuo
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Paper Abstract

The film thickness estimation is one of most important subject for the design up of photomask blank. TO decrease the producing cost of silicon semiconductor chips, control photomask specifications and evaluate thickness technologies are the key technology. The grazing-incidence x-ray reflectivity method is very useful in order to measure thickness, density and interface roughness of photomask blank. In this paper, we report the adaption of the x-ray reflectivity technology to photomask evaluation and prepare a thickness distribution map of mono- and multi-layer photomask blank. A Zrsi oxide thin photomask blanks were prepared with DC sputtering method. The x-ray reflectivities of those photomask thicknesses maps of the photomask blanks were calculated with RIGAKU $qq program. The $qq calculations require model structures of the mono- and double-layer photomask blank. We estimated model structures of the films for better fitting between measured and calculated $qq results. In the thickness distribution maps, the thickness were evaluated in Angstrom accuracy and a thickness difference between measurement positions were detected. The x-ray reflectivity method is a kind of high accuracy evaluation method is a kind of high accuracy evaluation method of photomask blank thickness distribution map.

Paper Details

Date Published: 19 July 2000
PDF: 11 pages
Proc. SPIE 4066, Photomask and Next-Generation Lithography Mask Technology VII, (19 July 2000); doi: 10.1117/12.392068
Show Author Affiliations
Teruyoshi Hirano, Toppan Printing Co., Ltd. (Japan)
Hiroshi Wada, Toppan Printing Co., Ltd. (Japan)
Masao Otaki, Toppan Printing Co., Ltd. (Japan)
Ryuji Matsuo, Rigaku Corp. (Japan)

Published in SPIE Proceedings Vol. 4066:
Photomask and Next-Generation Lithography Mask Technology VII
Hiroaki Morimoto, Editor(s)

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