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Proceedings Paper

Lithography performance of contact holes: I. Optimization of pattern fidelity using MPG and MPG-II
Author(s): Suzanne Weaver; Maiying Lu; Jan M. Chabala; Dinh Ton; Charles A. Sauer; Chris A. Mack
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Paper Abstract

Proximity effects make optimizing the pattern fidelity of contact holes one of the most challenging lithographic tasks in maskmaking. This paper examines the exposure and process parameters that influence the pattern fidelity of contact holes on a photomask from both a modeling and an experimental approach. To optimize contact critical dimension (CD) uniformity and corner rounding, a range of exposure and process variables is examined. These variables include MEBES writing strategy, input address, spot size, development time, and data bias. ProBEAM/3D, an electron- beam modeling software program, is used to model contact hole performance, and the results are verified with a design of experiments protocol using the same variables as in the simulation study. A simultaneous optimization of these parameters is instructive in matching the appropriate writing strategy and technology node with the desired quality of the contact hole.

Paper Details

Date Published: 19 July 2000
PDF: 12 pages
Proc. SPIE 4066, Photomask and Next-Generation Lithography Mask Technology VII, (19 July 2000); doi: 10.1117/12.392054
Show Author Affiliations
Suzanne Weaver, Etec Systems, Inc. (United States)
Maiying Lu, Etec Systems, Inc. (United States)
Jan M. Chabala, Etec Systems, Inc. (United States)
Dinh Ton, Etec Systems, Inc. (United States)
Charles A. Sauer, Etec Systems, Inc. (United States)
Chris A. Mack, FINLE Technologies, Inc. (United States)

Published in SPIE Proceedings Vol. 4066:
Photomask and Next-Generation Lithography Mask Technology VII
Hiroaki Morimoto, Editor(s)

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