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Proceedings Paper

Long linear HgCdTe arrays with superior temperature cycling reliability
Author(s): Johann Ziegler; Marcus Finck; Rolf Krueger; Thomas Simon; C. Joachim Wendler
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Paper Abstract

To meet the demands for high temperature-cycling reliability of HgCdTe detectors, bonded to a Silicon 'Read-Out-Integrated- Circuit,' AIM has developed a Multi-Chip-Module approach for the infrared Focal-Plane-Array. Bonding of detector array and Si-chips on a sapphire substrate minimizes thermal stress and strain in the FPA, leading to cycle-to-failure of >= 1000. For maximum cycle estimation under varying strain, a correlation was established empirically.

Paper Details

Date Published: 17 July 2000
PDF: 10 pages
Proc. SPIE 4028, Infrared Detectors and Focal Plane Arrays VI, (17 July 2000); doi: 10.1117/12.391751
Show Author Affiliations
Johann Ziegler, AEG Infrarot-Module GmbH (Germany)
Marcus Finck, AEG Infrarot-Module GmbH (Germany)
Rolf Krueger, AEG Infrarot-Module GmbH (Germany)
Thomas Simon, AEG Infrarot-Module GmbH (Germany)
C. Joachim Wendler, AEG Infrarot-Module GmbH (Germany)


Published in SPIE Proceedings Vol. 4028:
Infrared Detectors and Focal Plane Arrays VI
Eustace L. Dereniak; Robert E. Sampson, Editor(s)

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