Share Email Print

Proceedings Paper

Long linear HgCdTe arrays with superior temperature cycling reliability
Author(s): Johann Ziegler; Marcus Finck; Rolf Krueger; Thomas Simon; C. Joachim Wendler
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

To meet the demands for high temperature-cycling reliability of HgCdTe detectors, bonded to a Silicon 'Read-Out-Integrated- Circuit,' AIM has developed a Multi-Chip-Module approach for the infrared Focal-Plane-Array. Bonding of detector array and Si-chips on a sapphire substrate minimizes thermal stress and strain in the FPA, leading to cycle-to-failure of >= 1000. For maximum cycle estimation under varying strain, a correlation was established empirically.

Paper Details

Date Published: 17 July 2000
PDF: 10 pages
Proc. SPIE 4028, Infrared Detectors and Focal Plane Arrays VI, (17 July 2000); doi: 10.1117/12.391751
Show Author Affiliations
Johann Ziegler, AEG Infrarot-Module GmbH (Germany)
Marcus Finck, AEG Infrarot-Module GmbH (Germany)
Rolf Krueger, AEG Infrarot-Module GmbH (Germany)
Thomas Simon, AEG Infrarot-Module GmbH (Germany)
C. Joachim Wendler, AEG Infrarot-Module GmbH (Germany)

Published in SPIE Proceedings Vol. 4028:
Infrared Detectors and Focal Plane Arrays VI
Eustace L. Dereniak; Robert E. Sampson, Editor(s)

© SPIE. Terms of Use
Back to Top