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Proceedings Paper

Carbon fiber composite photomask stage component
Author(s): Brian E. Catanzaro; Jack E. Dyer; David Trost
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Paper Abstract

The semiconductor industry utilizes complex patterning tools to achieve the patterning of fine features. These tools require stiff, lightweight, dimensionally stable components in order to reliably pattern photomasks and wafers. Traditionally, these tools have used metals, ceramics, and low expansion glasses. However, a new class of materials, high performance composites, has demonstrated promise for replacing these materials. This paper discusses the design, manufacturing, and test of a carbon fiber composite stage component of an electron beam lithography tool.

Paper Details

Date Published: 21 July 2000
PDF: 11 pages
Proc. SPIE 3997, Emerging Lithographic Technologies IV, (21 July 2000); doi: 10.1117/12.390103
Show Author Affiliations
Brian E. Catanzaro, Composite Optics, Inc. (United States)
Jack E. Dyer, Composite Optics, Inc. (United States)
David Trost, Etec Systems, Inc. (United States)


Published in SPIE Proceedings Vol. 3997:
Emerging Lithographic Technologies IV
Elizabeth A. Dobisz, Editor(s)

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