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Proceedings Paper

Nikon stepper process program parameter optimization and overlay improvement
Author(s): LuJia Chen; Lim Hui Kow; Wenzhan Zhou; Graham C. Ruck; Li Zheng
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Paper Abstract

The accuracy of feature overlapping has been one of the most important challenges required in the manufacturing of advanced microelectronic devices. This paper explores the application of Nikon stepper alignment skills and overlay modeling which includes the relationship between Nikon stepper process program parameters and overlay performance. The distribution and number of experiments were carried out to check out the crucial parameters, which will affect overlay individually. In order to characterize the performance of each parameter settings, criteria excluding the alignment error caused by stepper matching and overlay error caused by KLA measurement.

Paper Details

Date Published: 21 July 2000
PDF: 12 pages
Proc. SPIE 3997, Emerging Lithographic Technologies IV, (21 July 2000); doi: 10.1117/12.390101
Show Author Affiliations
LuJia Chen, Chartered Semiconductor Manufacturing Ltd. (Singapore)
Lim Hui Kow, Chartered Semiconductor Manufacturing Ltd. (Singapore)
Wenzhan Zhou, Chartered Semiconductor Manufacturing Ltd. (Singapore)
Graham C. Ruck, Chartered Semiconductor Manufacturing Ltd. (Singapore)
Li Zheng, Chartered Semiconductor Manufacturing Ltd. (Singapore)

Published in SPIE Proceedings Vol. 3997:
Emerging Lithographic Technologies IV
Elizabeth A. Dobisz, Editor(s)

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