Share Email Print

Proceedings Paper

Thermomechanical modeling of the SCALPEL mask during exposure
Author(s): Carl J. Martin; Roxann L. Engelstad; Edward G. Lovell; James Alexander Liddle
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Thermal deformations of lithographic masks during the exposure process may become an important consideration for all candidate Next Generation Lithography technologies. In,the Electron Projection Lithography exposure process, an electron beam passes through thin membrane sections of the mask scattering the electrons of the pattern area. A small fraction of the e-beam energy is absorbed in the membranes producing a local temperature rise. This temperature rise produces thermomechanical distortions that can result in both image placement errors and image blur. Finite element methods have been used to model the exposure process of the Scattering with Angular Limitation Projection Electron-beam Lithography (SCALPEL) mask. Thermal and structural finite element models have been generated to simulate the response of the SCALPEL mask during the exposure process and predict the resulting thermomechanical distortions. The results of these finite element analyses and the contributions of the thermal deformations to image placement error are presented.

Paper Details

Date Published: 21 July 2000
PDF: 11 pages
Proc. SPIE 3997, Emerging Lithographic Technologies IV, (21 July 2000); doi: 10.1117/12.390094
Show Author Affiliations
Carl J. Martin, Univ. of Wisconsin/Madison (United States)
Roxann L. Engelstad, Univ. of Wisconsin/Madison (United States)
Edward G. Lovell, Univ. of Wisconsin/Madison (United States)
James Alexander Liddle, Lucent Technologies (United States)

Published in SPIE Proceedings Vol. 3997:
Emerging Lithographic Technologies IV
Elizabeth A. Dobisz, Editor(s)

© SPIE. Terms of Use
Back to Top