Share Email Print

Proceedings Paper

High-throughput NGL electron-beam direct-write lithography system
Author(s): N. William Parker; Alan D. Brodie; John H. McCoy
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Electron beam lithography systems have historically had low throughput. The only practical solution to this limitation is an approach using many beams writing simultaneously. For single-column multi-beam systems, including projection optics (SCALPELR and PREVAIL) and blanked aperture arrays, throughput and resolution are limited by space-charge effects. Multibeam micro-column (one beam per column) systems are limited by the need for low voltage operation, electrical connection density and fabrication complexities. In this paper, we discuss a new multi-beam concept employing multiple columns each with multiple beams to generate a very large total number of parallel writing beams. This overcomes the limitations of space-charge interactions and low voltage operation. We also discuss a rationale leading to the optimum number of columns and beams per column. Using this approach we show how production throughputs >= 60 wafers per hour can be achieved at CDs <EQ 100 nm, independent of both wafer diameter and die size. The Cost-of-Ownership (CoO) advantages of direct-write (maskless) lithography are significant especially for small-volume semiconductor fabrication, for example ASICs, SOCs and MPUs.

Paper Details

Date Published: 21 July 2000
PDF: 8 pages
Proc. SPIE 3997, Emerging Lithographic Technologies IV, (21 July 2000); doi: 10.1117/12.390042
Show Author Affiliations
N. William Parker, Ion Diagnostics, Inc. (United States)
Alan D. Brodie, Ion Diagnostics, Inc. (United States)
John H. McCoy, Ion Diagnostics, Inc. (United States)

Published in SPIE Proceedings Vol. 3997:
Emerging Lithographic Technologies IV
Elizabeth A. Dobisz, Editor(s)

© SPIE. Terms of Use
Back to Top