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Proceedings Paper

Step and stamp imprint lithography using a commercial flip chip bonder
Author(s): Tomi Haatainen; Jouni Ahopelto; Gabi Gruetzner; Marion Finck; Karl Pfeiffer
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Paper Abstract

In this work we describe a new method suitable for large area nanoimprint lithography. In step&stamp process the pattern on a stamp is transferred into a polymer layer on the substrate by repeating a step&stamp cycle. The method is demonstrated by imprinting matrices of test structures on polymer-coated 100 mm silicon wafers. A new polymer, PPM, is used as resist in the experiments. The polymer has been developed to fulfill the demands of imprint lithography. Patterns with sizes down to 400 nm were imprinted into either 100 nm or 340 nm thick PPM resist. After thinning in oxygen plasma, the resist layer is used as etching mask or for fabrication of interdigitated aluminum fingers by lift-off.

Paper Details

Date Published: 21 July 2000
PDF: 7 pages
Proc. SPIE 3997, Emerging Lithographic Technologies IV, (21 July 2000); doi: 10.1117/12.390036
Show Author Affiliations
Tomi Haatainen, VTT Microelectronics (Finland)
Jouni Ahopelto, VTT Microelectronics (Finland)
Gabi Gruetzner, Micro Resist Technology GmbH (Germany)
Marion Finck, Micro Resist Technology GmbH (Germany)
Karl Pfeiffer, Micro Resist Technology GmbH (Germany)


Published in SPIE Proceedings Vol. 3997:
Emerging Lithographic Technologies IV
Elizabeth A. Dobisz, Editor(s)

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