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Proceedings Paper

Comparison of the mechanisms of hydrogenation by rf plasma and SiNx
Author(s): LiMing Wang; HsixgJu Sung; I-Min Lu; I-Wei Wu
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Paper Abstract

In low temperature poly-silicon TFT's, the electrical characteristics are controlled by the inter- and intra-grain defects in the poly-silicon films. Hydrogen passivation is an effective way to reduce the density of these defects and can improve TFT's characteristics. In this study we investigated the characteristics of TFT's as a function of the hydrogenation time for two different hydrogenation techniques: H2/Ar plasma and PECVD silicon nitride film deposition. It was found that the characteristics of TFTs could be greatly improved after a very short period of time by both hydrogenation processes. In the H2/Ar RF plasma hydrogenation process, the characteristic parameters would be apparently improved within 30 min., and with only limited improvement after that. In the nitride hydrogenation process, the electrical characteristics of TFTs would be optimized within 5 min. of annealing, but started to degrade with loner annealing time. From these result, we concluded that the hydrogenation mechanism of these two techniques are very much different from each other.

Paper Details

Date Published: 30 June 2000
PDF: 4 pages
Proc. SPIE 4079, Display Technologies III, (30 June 2000); doi: 10.1117/12.389425
Show Author Affiliations
LiMing Wang, Industrial Technology Research Institute (Taiwan)
HsixgJu Sung, Industrial Technology Research Institute (Taiwan)
I-Min Lu, Industrial Technology Research Institute (Taiwan)
I-Wei Wu, Industrial Technology Research Institute (Taiwan)


Published in SPIE Proceedings Vol. 4079:
Display Technologies III
I-Wei Wu; Heiju Uchiike, Editor(s)

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