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Proceedings Paper

Overlay performance in advanced processes
Author(s): Frank Bornebroek; Jaap Burghoorn; James S. Greeneich; Henry J. L. Megens; Danu Satriasaputra; Geert Simons; Sunny Stalnaker; Bert Koek
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Paper Abstract

To guarantee less than 45 nm product overlay required for the 130 nm IC technology node a key in lithographic tools is a sophisticated wafer alignment sensor that is able to deal with the influences of new, advanced IC processing. To prove that product overlay performance in this range is achievable, overlay results are presented that confirm the operational concept of the new ATHENA alignment sensor on various advanced processes in both front-end as well as back-end-of-line. In particular, the influences related to Chemical Mechanical Polishing (CMP) have been studied. The robustness of the system to large variations of W-CMP process parameters is highlighted. It is argued that full exploitation of the flexibility of the sensor will allow further optimization of its operation in actual production environments and that a product overlay of 35 nm is feasible.

Paper Details

Date Published: 5 July 2000
PDF: 12 pages
Proc. SPIE 4000, Optical Microlithography XIII, (5 July 2000); doi: 10.1117/12.389040
Show Author Affiliations
Frank Bornebroek, ASML (Netherlands)
Jaap Burghoorn, ASML (Netherlands)
James S. Greeneich, ASML (Netherlands)
Henry J. L. Megens, ASML (Netherlands)
Danu Satriasaputra, ASML (Netherlands)
Geert Simons, ASML (Netherlands)
Sunny Stalnaker, ASML (Netherlands)
Bert Koek, ASML (Netherlands)


Published in SPIE Proceedings Vol. 4000:
Optical Microlithography XIII
Christopher J. Progler, Editor(s)

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