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Proceedings Paper

Issues and nonissues on a 193-nm step-and-scan system in production
Author(s): Jeff A. Schefske; Eric Kent; Uzodinma Okoroanyanwu; Harry J. Levinson; Charles R. Masud; Bob Streefkerk; Ralph M. Hanzen; Joerg Brueback
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Paper Abstract

With the delivery of 193nm exposure tool to several production fabs in the past year, we are now able to identify potential issues with this technology. For 193 nm lithoghpray, lifetime issues associated with the optical elements have been a big concern in the industry. Early learnings of optical component lifetimes for a 193nm step- and-scan system in pilot lien operation are reviewed. The performance and stability of line-narrowed ArF excimer lasers have also been unknowns in a production fab until now. High voltage and pulse length trends on the ArF laser are discussed. Data for lens heating effects on focus is presented. Stray light data will also be included in this paper. Observations related to the practical operation of a 193nm exposure tool as well as 193nm specific error modes will be shared. Finally, key areas where improvement is needed to ensure that 193nm lithography will be a cost- effective manufacturing technology are identified.

Paper Details

Date Published: 5 July 2000
PDF: 12 pages
Proc. SPIE 4000, Optical Microlithography XIII, (5 July 2000); doi: 10.1117/12.389035
Show Author Affiliations
Jeff A. Schefske, Advanced Micro Devices, Inc. (United States)
Eric Kent, Advanced Micro Devices, Inc. (United States)
Uzodinma Okoroanyanwu, Advanced Micro Devices, Inc. (United States)
Harry J. Levinson, Advanced Micro Devices, Inc. (United States)
Charles R. Masud, ASML (United States)
Bob Streefkerk, ASML (Netherlands)
Ralph M. Hanzen, ASML (Netherlands)
Joerg Brueback, ASML (Netherlands)


Published in SPIE Proceedings Vol. 4000:
Optical Microlithography XIII
Christopher J. Progler, Editor(s)

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