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Proceedings Paper

Techniques to print sub-0.2-um contact holes
Author(s): Kayo Aramaki; T. Hamada; DongKwan Lee; Hiroshi Okazaki; Naoko Tsugama; Georg Pawlowski
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Paper Abstract

The present paper examines the applicability of three basic resist types (acetal, hybrid, t-butylester) to print sub-0.2 micrometer contact holes (C/H) using state-of-the-art illumination and processing techniques. In terms of ultimate resolution and DOF the acetal-based material showed the best performance under standard processing conditions, but exhibited serious limitations upon application of a half-tone phase-shift mask (HT-PSM) due to side-lobe formation. The hybrid material showed significantly better HT-PSM compatibility and -- due to an enhanced adaptability to practical thermal flow processes -- the best results upon application of a postbake to trigger thermally induced shrinkage. The t-butylester material usually performed second to the best under any selected illumination condition, and may be considered as top performer from a general point of view as no real show-stopper was observed. Thermal flow results of the hybrid material are discussed in more detail and briefly compared with alternate shrinking technologies, such as RELACSTM or CARLTM.

Paper Details

Date Published: 23 June 2000
PDF: 12 pages
Proc. SPIE 3999, Advances in Resist Technology and Processing XVII, (23 June 2000); doi: 10.1117/12.388360
Show Author Affiliations
Kayo Aramaki, Clariant (Japan) K.K. (Japan)
T. Hamada, Clariant (Japan) K.K. (Japan)
DongKwan Lee, Clariant (Japan) K.K. (Japan)
Hiroshi Okazaki, Clariant (Japan) K.K. (Japan)
Naoko Tsugama, Clariant (Japan) K.K. (Japan)
Georg Pawlowski, Clariant (Japan) K.K. (United States)

Published in SPIE Proceedings Vol. 3999:
Advances in Resist Technology and Processing XVII
Francis M. Houlihan, Editor(s)

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