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Proceedings Paper

Certified photometric standard for quality control and validation in UV/VIS analysis of lithographic resist materials and processes
Author(s): Aron L. Shultz; Kathy McLain; Jerry D. Messman
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Paper Abstract

This paper describes a new certified reference material (CRM) intended specifically for independent benchmark validation and quality control of laboratory spectrophotometric measurements on lithographic research test materials. The photometric standard (CRM 500) is comprised of three individual neutral- density quartz filters having nominal percent transmittances of 10% T, 30% T and 90% T (nominal transmittance densities of 1.0, 0.5 and 0.04, respectively). The optical transmittance (T) and transmittance density (-log10T) of each filter is certified at discrete spectral wavelengths corresponding to the exposure wavelengths at which optical steppers are operated. Applicable to deep ultraviolet (DUV) lithography, the CRM 500 standard is custom certifiable at spectral wavelengths down to 193 nm. The certified photometric values and their associated expanded uncertainties are provided at each wavelength. The photometric certification of each filter is benchmarked and traceable to a relevant standard (SRMR 2031) from the National Institute of Standards and Technology (NIST). To ensure that the certified reference values at a given wavelength are accurate and valid at the time of the user measurement, the CRM 500 photometric standard must be recertified at appropriate intervals. A paradigm is presented for the open-loop photometric certification of the CRM 500 standard at ten custom wavelengths in the spectral range 193 nm to 700 nm.

Paper Details

Date Published: 23 June 2000
PDF: 9 pages
Proc. SPIE 3999, Advances in Resist Technology and Processing XVII, (23 June 2000); doi: 10.1117/12.388350
Show Author Affiliations
Aron L. Shultz, SpectroStandards Analytical (United States)
Kathy McLain, SpectroStandards Analytical (United States)
Jerry D. Messman, SpectroStandards Analytical (United States)


Published in SPIE Proceedings Vol. 3999:
Advances in Resist Technology and Processing XVII
Francis M. Houlihan, Editor(s)

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