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Proceedings Paper

ArF photoresist containing novel acid labile cross-linker for high contrast and PED stability
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Paper Abstract

In our previous model, we have introduced a lot of t- butylcarboxylate group in matrix resin to achieve a high contrast and obtain a good lithographic performance. Most ArF photoresists having only t-butylcarboxylate group as a dissolution inhibitor have showed by far the inferior performance in a poor amine controlled environment. To overcome this problem, we greatly reduced the usage of t-butyl carboxylate group and increased the amount of HMEBC that contains both carboxylic acid group and alcohol group. And also, we newly introduced acid labile cross-linker for high contrast. Our novel resist exhibited an excellent lithographic performance without any protective top coating material, namely, a good PED (post exposure delay) stability, an improved CD (Critical Dimension) linearity, a proper sensitivity for process, and a good contrast. In addition, its synthetic yield is very high (>50%) and then it is cost- effective for mass production. 120 nm patterns were successfully defined at 13 mJ/cm2 by using a BIM (Binary Intensity Mask) with 2/3 annular (0.50/0.75(sigma) ).

Paper Details

Date Published: 23 June 2000
PDF: 10 pages
Proc. SPIE 3999, Advances in Resist Technology and Processing XVII, (23 June 2000); doi: 10.1117/12.388303
Show Author Affiliations
Geunsu Lee, Hyundai Electronics Industries Co., Ltd. (South Korea)
Cha-Won Koh, Hyundai Electronics Industries Co., Ltd. (South Korea)
Sung-Eun Hong, Hyundai Electronics Industries Co., Ltd. (South Korea)
Jae Chang Jung, Hyundai Electronics Industries Co., Ltd. (South Korea)
Min-Ho Jung, Hyundai Electronics Industries Co., Ltd. (South Korea)
Hyeong-Soo Kim, Hyundai Electronics Industries Co., Ltd. (South Korea)
Ki-Ho Baik, Hyundai Electronics Industries Co., Ltd. (United States)


Published in SPIE Proceedings Vol. 3999:
Advances in Resist Technology and Processing XVII
Francis M. Houlihan, Editor(s)

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