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Proceedings Paper

Environmental stability of chemically amplified resists: proposing an industry standard methodology for testing
Author(s): Kim R. Dean; Oleg P. Kishkovich
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Paper Abstract

The authors propose the establishment of a new industry standard methodology for testing the environmental stability of chemically amplified chemical resists. Preparatory to making this proposal, they developed a pertinent test apparatus and test procedure that might be used uniformly as an industry-wide best practice. To demonstrate and validate their proposed methodology, the authors subjected two different 193 nm chemically amplified photoresists to test conditions in the 'torture chamber,' simulating actual lithographic environmental scenarios. Depending on the variables of each test run (e.g., different resists, different resist thicknesses, different pollutants, different concentrations, and different humidity levels), a variety of defects were noted and described quantitatively. Of the three contaminants tested, ammonia had the strongest effect. The thin resists were more strongly affected by the contamination.

Paper Details

Date Published: 23 June 2000
PDF: 10 pages
Proc. SPIE 3999, Advances in Resist Technology and Processing XVII, (23 June 2000); doi: 10.1117/12.388295
Show Author Affiliations
Kim R. Dean, International SEMATECH (United States)
Oleg P. Kishkovich, Extraction Systems, Inc. (United States)


Published in SPIE Proceedings Vol. 3999:
Advances in Resist Technology and Processing XVII
Francis M. Houlihan, Editor(s)

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