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Proceedings Paper

Selectively deposited copper on laser-treated polyimide using electroless plating
Author(s): Gang Zhao; Harvey M. Phillips; HongYu Zheng; Siu Chung Tam; Wen Qing Liu; Gongling Wen; Zhiben Gong; Yee Loy Lam
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Paper Abstract

Many reviews about the interconnection line fabrication by laser processing method were reported recently. UV laser process polyimide has been studied thoroughly during the past decade. In this report, we discussed the utilization of surface potential changing on polyimide film irradiated by excimer KrF laser and metallized the UV laser treated polyimide surface by electroless copper deposition. A new negatively charged polymer stabilized Pd solution was applied as catalyst in this experiment. We also produced pattern-wised fine line on KrF laser induced PI surface using this method.

Paper Details

Date Published: 7 June 2000
PDF: 6 pages
Proc. SPIE 3933, Laser Applications in Microelectronic and Optoelectronic Manufacturing V, (7 June 2000); doi: 10.1117/12.387591
Show Author Affiliations
Gang Zhao, Nanyang Technological Univ., Gintic Institute of Manufacturing Technology, and Anhui Inst. (Singapore)
Harvey M. Phillips, Gintic Institute of Manufacturing Technology (Singapore)
HongYu Zheng, Gintic Institute of Manufacturing Technology (Singapore)
Siu Chung Tam, Nanyang Technological Univ. (Singapore)
Wen Qing Liu, Anhui Institute of Optics and Fine Mechanics (Japan)
Gongling Wen, Anhui Institute of Optics and Fine Mechanics (China)
Zhiben Gong, Anhui Institute of Optics and Fine Mechanics (China)
Yee Loy Lam, Nanyang Technological Univ. (Singapore)


Published in SPIE Proceedings Vol. 3933:
Laser Applications in Microelectronic and Optoelectronic Manufacturing V
Henry Helvajian; Koji Sugioka; Malcolm C. Gower; Jan J. Dubowski, Editor(s)

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