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Proceedings Paper

CO2 laser drilling of printed wiring boards and development of in-process monitoring system
Author(s): Takayuki Nakayama; Tomokazu Sano; Isamu Miyamoto; Kenichiro Tanaka; Yuichi Uchida
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Paper Abstract

In this paper, CO2 laser drilling process for printed wiring board and the application to the in-process monitoring of the via hole quality are described. The process of CO2 laser drilling was investigated on the basis of high speed photograph, the light emission and thermal conduction. It was found that the temperature of the decomposed epoxy resin suddenly increased when the smear thickness become less than 2μm. Based on this analysis, a simple in-process monitoring technique was developed to estimate the smear feature by detecting the light emission using a photo sensor. The removing process of the smear by KrF excimer laser was also investigated on the basis of the spectrum of the light emission and the reflected excimer laser. The electric contact was accomplished by excimer laser removal the smear.

Paper Details

Date Published: 7 June 2000
PDF: 8 pages
Proc. SPIE 3933, Laser Applications in Microelectronic and Optoelectronic Manufacturing V, (7 June 2000); doi: 10.1117/12.387577
Show Author Affiliations
Takayuki Nakayama, Osaka Univ. (Japan)
Tomokazu Sano, Osaka Univ. (Japan)
Isamu Miyamoto, Osaka Univ. (Japan)
Kenichiro Tanaka, Matsushita Electric Works, Ltd. (Japan)
Yuichi Uchida, Matsushita Electric Works, Ltd. (Japan)

Published in SPIE Proceedings Vol. 3933:
Laser Applications in Microelectronic and Optoelectronic Manufacturing V
Henry Helvajian; Koji Sugioka; Malcolm C. Gower; Jan J. Dubowski, Editor(s)

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