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Proceedings Paper

Laser chemical process for clean applications of semiconductor manufacturing
Author(s): David Yogev; Michael Y. Engel; Shaike Zeid; Izhack Barzilay; Boris Livshits
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Paper Abstract

Cleaning applications in the semiconductor manufacturing industry are tougher to meet as the device dimensions decrease. The uniqueness of Oramir-Laser-Chemical process relies on the mutual combination and effectiveness of laser particle removal mechanisms and laser induced photon- thermal-chemical reaction in the mixture of O2/O3/NF3 gases. The process involves ozone blast wave, photodecomposition of O3 into O radicals, photo-thermal decomposition of NF3 into fluorine radicals, thermal effects and thin liquid-chemical ablation enhanced particle removal. Recent results on Bare Si wafers, photomasks, EUV masks and scalpel masks show substantial removal efficiency, up to 100 percent for certain applications.

Paper Details

Date Published: 7 June 2000
PDF: 12 pages
Proc. SPIE 3933, Laser Applications in Microelectronic and Optoelectronic Manufacturing V, (7 June 2000); doi: 10.1117/12.387543
Show Author Affiliations
David Yogev, ORAMIR Semiconductor Equipment Ltd. (Israel)
Michael Y. Engel, ORAMIR Semiconductor Equipment Ltd. (Israel)
Shaike Zeid, ORAMIR Semiconductor Equipment Ltd. (Israel)
Izhack Barzilay, ORAMIR Semiconductor Equipment Ltd. (Israel)
Boris Livshits, ORAMIR Semiconductor Equipment Ltd. (Israel)


Published in SPIE Proceedings Vol. 3933:
Laser Applications in Microelectronic and Optoelectronic Manufacturing V
Henry Helvajian; Koji Sugioka; Malcolm C. Gower; Jan J. Dubowski, Editor(s)

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