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Proceedings Paper

256-channel bidirectional optical interconnect using VCSELs and photodiodes on CMOS
Author(s): David V. Plant; John Alfred Trezza; Michael B. Venditti; Emmanuelle Laprise; Julien Faucher; Kevan Razavi; Marc Chateauneuf; Andrew G. Kirk; W. Luo
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Paper Abstract

2D Parallel Optical Interconnects are capable of providing large connectivity between elements in computing and switching systems. Using this technology we have demonstrated a bi-directional optical interconnect between two PCBs containing optoelectronic VLSI circuits. The OE- VLSI circuits were constructed using VCSELs and photodiodes flip-chip bump bonded to a 0.35 micrometers CMOS chip. The CMOS was comprised of 256 Vertical Cavity Surface Emitting Laser (VCSEL) drivers, 256 receivers, and the requisite buffer and control circuits required to operate the large transceiver array. This is the first system, to our knowledge, to send bi-directional data optically between optoelectronic VLSI chips which have both VCSELs and photodiodes co-integrated on the same substrate.

Paper Details

Date Published: 24 May 2000
PDF: 9 pages
Proc. SPIE 4089, Optics in Computing 2000, (24 May 2000); doi: 10.1117/12.386799
Show Author Affiliations
David V. Plant, McGill Univ. (Canada)
John Alfred Trezza, Sanders, A Lockheed Martin Co. (United States)
Michael B. Venditti, McGill Univ. (Canada)
Emmanuelle Laprise, McGill Univ. (Canada)
Julien Faucher, McGill Univ. (Canada)
Kevan Razavi, McGill Univ. (Canada)
Marc Chateauneuf, McGill Univ. (Canada)
Andrew G. Kirk, McGill Univ. (Canada)
W. Luo, Emcore (United States)

Published in SPIE Proceedings Vol. 4089:
Optics in Computing 2000
Roger A. Lessard; Tigran V. Galstian, Editor(s)

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