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Proceedings Paper

Alignment-free optical modules using solder-bump-bonding technique for free-space optical interconnections
Author(s): Daisuke Miyazaki; Yuji Ohno; Kenji Matsushita
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Paper Abstract

An optical packaging scheme based on alignment-free optical modules for free-space interconnection is presented. Solder- bump-bonding technique is introduced to achieve precise self-alignment in free-space optical system. The proposed method is verified by experimental fabrication of optical modules.

Paper Details

Date Published: 24 May 2000
PDF: 6 pages
Proc. SPIE 4089, Optics in Computing 2000, (24 May 2000); doi: 10.1117/12.386794
Show Author Affiliations
Daisuke Miyazaki, Osaka City Univ. (United States)
Yuji Ohno, Osaka City Univ. (Japan)
Kenji Matsushita, Osaka City Univ. (Japan)

Published in SPIE Proceedings Vol. 4089:
Optics in Computing 2000
Roger A. Lessard; Tigran V. Galstian, Editor(s)

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