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Proceedings Paper

Integrated reflectance for monitoring silicon oxynitride antireflective coatings on a CVD cluster tool
Author(s): James Matt Holden; William A. McGahan; Martin J. Seamons
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Paper Abstract

A mapping reflectometer has been integrated into the load robotics of a multi-chamber, thin film deposition tool. Normal incidence reflectance metrology is used to monitor PE-CVD silicon oxynitride films. Reflectance data is modeled to obtain film thickness and extrapolate refractive index and extinction coefficient at DUV wavelengths using an interpolation dispersion model. The interpolation model is an empirical, process specific dispersion model that uses one or two adjustable parameters to interpolate between well- characterized 'node' films. The node film dispersions are characterized by multiple-angle spectroscopic ellipsometry over the spectral range of 200 nm to 800 nm. The model parameters are correlated to process variables which affect the index of the deposited oxynitride film directly such as the SiH4:N2O flow ratio and the total flow. The capabilities of the instrument are demonstrated by measuring a 5-layer, ILD stack for a dual damascene/copper process.

Paper Details

Date Published: 2 June 2000
PDF: 9 pages
Proc. SPIE 3998, Metrology, Inspection, and Process Control for Microlithography XIV, (2 June 2000); doi: 10.1117/12.386493
Show Author Affiliations
James Matt Holden, Nanometrics Inc. (United States)
William A. McGahan, Nanometrics Inc. (United States)
Martin J. Seamons, Applied Materials (United States)


Published in SPIE Proceedings Vol. 3998:
Metrology, Inspection, and Process Control for Microlithography XIV
Neal T. Sullivan, Editor(s)

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