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Proceedings Paper

Effect on properties of 42Sn58Bi solder joint by adding the 96.5Sn3.5Ag
Author(s): Qinghua Tang; Xiaoguang Pan; C. M. L. Wu; Y. C. Chan
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Paper Abstract

The different composition in 42Sn58Bi and 96.5Sn3.5Ag system has been studied. The reflow conditions of various composition pastes were studied, and a suitable adding of Sn-Ag paste could raise the soldering temperature of paste. It was found that the shear tensile strength of solder joint could be improved after adding suitable Sn-Ag to Sn-Bi paste by testing the solder joint tension. The thermal fatigue properties were studied through performed thermal annealing and thermal shocking. The shear tensile strength of solder joints for adding suitable Sn-Ag is higher than the pure Sn- Bi after thermal shocking. The solder property, mechanical and fatigue failure properties of solder joint for adding suitable Sn-Ag could be improved. It was found that suitable Sn-Ag could decrease the porosity in Sn-Bi solder joint thought X-ray and SEM analysis.

Paper Details

Date Published: 9 May 2000
PDF: 3 pages
Proc. SPIE 4077, International Conference on Sensors and Control Techniques (ICSC 2000), (9 May 2000); doi: 10.1117/12.385589
Show Author Affiliations
Qinghua Tang, Huazhong Univ. of Science and Technology (China)
Xiaoguang Pan, Huazhong Univ. of Science and Technology (China)
C. M. L. Wu, City Univ. of Hong Kong (Hong Kong)
Y. C. Chan, Huazhong Univ. of Science and Technology (China)


Published in SPIE Proceedings Vol. 4077:
International Conference on Sensors and Control Techniques (ICSC 2000)
Desheng Jiang; Anbo Wang, Editor(s)

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