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Proceedings Paper

Imaging CSP: a die-size optical package for CMOS imagers and CCDs
Author(s): Itzik Shweky; Avner P. Badihi
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Paper Abstract

integrated Circuits (IC) and other sophisticated electronics consumer goods are commonplace in cameras of all kinds, sizes and price range. Today's state of the art digital imaging now makes it possible to achieve photographic quality at levels sufficient to support the growth of cameras applications such as video conferencing, video phones and Video Cellular phones, video Email and WEB site imaging. Additionally, to generate mass market appeal, digital imaging technology integrators and camera manufacturers had lowered the price of their products, increasing the pressure to lower the cost of the imaging engine, including both the die and the package. A newly introduced Die Size, Opto-Electronic Package offers a substantial reduction of both package costs and size (1,2). It provides the smallest and thinnest optical package for solid state light detectors and imaging devices such as CCD's and CMOS, and enables new applications which could not be realized with the current packaging technology. Colored imaging devices, in a variety of sizes have been packaged (figure 1). Optronic CSP's offer excellent dimensional accuracies with very tight mechanical tolerances.

Paper Details

Date Published: 15 May 2000
PDF: 6 pages
Proc. SPIE 3965, Sensors and Camera Systems for Scientific, Industrial, and Digital Photography Applications, (15 May 2000); doi: 10.1117/12.385458
Show Author Affiliations
Itzik Shweky, Shellcase Ltd. (Israel)
Avner P. Badihi, ShellCase Ltd. (Israel)

Published in SPIE Proceedings Vol. 3965:
Sensors and Camera Systems for Scientific, Industrial, and Digital Photography Applications
Morley M. Blouke; Nitin Sampat; Thomas Yeh; Nitin Sampat; George M. Williams; Thomas Yeh, Editor(s)

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