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Proceedings Paper

Finite element modeling for the flexural vibration of damped sandwich beams considering complex modulus of the adhesive layer
Author(s): Yanchu Xu; Dennis Chen
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Paper Abstract

A new finite element type, compound beam element, is derived for sandwich beam by considering the effects of both shear and thickness deformation in the adhesive layer. The new element type overcomes some limitations with the conventional finite element method, in which modal strain energy method is normally used for structural damping analysis. Modal strain energy method becomes quite inaccurate when the damping of the structure becomes high because it is always assumed that the structural modal shapes are real while actual modal shapes of the damped structures are quite complex. For achieving the best damping effect, the thickness of the damping layer is normally very thin, which requires great amount of elements in conventional finite element modeling to get a proper aspect ratio for accurate prediction. In compound beam element, all base beam layers and adhesive layer are modeled into a single element. The use of the element will result in significant simplification of sandwich beam modeling and dramatic reduction of element density while maintaining the desired accuracy. The use of the element also allows consideration of complex modulus of the adhesive material in the analysis and calculation of complex modal shapes of the damped structure.

Paper Details

Date Published: 27 April 2000
PDF: 9 pages
Proc. SPIE 3989, Smart Structures and Materials 2000: Damping and Isolation, (27 April 2000); doi: 10.1117/12.384553
Show Author Affiliations
Yanchu Xu, Maxtor Corp. (United States)
Dennis Chen, Maxtor Corp. (United States)


Published in SPIE Proceedings Vol. 3989:
Smart Structures and Materials 2000: Damping and Isolation
T. Tupper Hyde, Editor(s)

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