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Proceedings Paper

High-speed low-loss large-fan-out optoelectronic clock distribution networks on multichip modules by using silica glass waveguides and silicon microstructures
Author(s): Seungug Koh; Sung-Dong Suh; Danjin Wu; Daniel J. Sadler
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Paper Abstract

Guided-wave optoelectronic clock distribution networks on multichip modules (MCMs) are designed and fabricated to meet the high-speed clocking requirements of next-generation digital systems through a realization of superior network bandwidth, low power consumption, and large fanout capabilities compared to electrical interconnect counterparts. The sixteen-fanout H-tree clock distribution networks on MCMs is demonstrated by combining silica glass waveguides and micromachined silicon microstructures. The proposed optoelectronic multichip modules (OE-MCMs) with silica glass networks can be fabricated in a CMOS compatible batch process without modifying the conventional IC fabrication facilities. The proposed OE-MCM assembly/packaging processes are simple and cost-effective by sing self-alignment silicon microstructures. The design issues of optoelectronic H-tree networks and micromachined alignment structures for assembly/packaging processes are presented and discussed to improve the overall system performance while minimizing the system cost. The silica glass clock distribution networks and mosaic silicon mirror arrays are characterized at wavelengths of 1310 nm and 1550 nm by measuring overall optical power losses and signal uniformity.

Paper Details

Date Published: 27 April 2000
PDF: 9 pages
Proc. SPIE 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II, (27 April 2000); doi: 10.1117/12.384428
Show Author Affiliations
Seungug Koh, Louisiana Tech Univ. (United States)
Sung-Dong Suh, Louisiana Tech Univ. (United States)
Danjin Wu, ITI (United States)
Daniel J. Sadler, Univ. of Cincinnati (United States)


Published in SPIE Proceedings Vol. 3952:
Optoelectronic Interconnects VII; Photonics Packaging and Integration II
Michael R. Feldman; Richard Liqiang Li; Michael R. Feldman; Richard Liqiang Li; W. Brian Matkin; Suning Tang, Editor(s)

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