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Proceedings Paper

Self-aligned laser-fiber coupling using tin/gold (20/80) solder on micro-optical silicon benches
Author(s): Ulf-Peter Dahms; Viki Muellerwiebus; Hans Joachim Heider; Matthias Mahnke; Mark Bludszuweit; Joerg Mueller
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Paper Abstract

The efficiency of laserdiode-monomode fiber coupling is one of the essential assignments for interactive optical telecommunications. In this paper, we present our investigations and results of the development of such couplers, especially of a soldering process for hybridly joining a laser on a silicon microoptical bench by self adjustment. To achieve the necessary adjustment tolerances of better than 0.5 micrometers , the influence of the solder height for the self-alignment process is simulated with respect to the lowest allowable solder thickness, which still generates the necessary alignment forces. Because of the excellent properties at their coupling facet U-grooves were fabricated to mount the fiber by deep and high precision anisotropic reactive ion etching of silicon using SF6/CBrF3 gas- mixtures. The solder was deposited in buried structures by electroplating gold and tin at the eutectic ratio to allow optimum adjustment in vertical and lateral dimensions. Furthermore, the results of a fluxless soldering process in a UV-light activated forming gas atmosphere is presented and compared to the simulations. The measurement of the coupling efficiency to fibers will also be illustrated. The design of the microoptical bench allows to extend the system by incorporating e.g. a faraday rotator or other optoelectronic integrated circuits, like transceivers.

Paper Details

Date Published: 27 April 2000
PDF: 8 pages
Proc. SPIE 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II, (27 April 2000); doi: 10.1117/12.384423
Show Author Affiliations
Ulf-Peter Dahms, Mikroelektronik Anwendungszentrum (Germany)
Viki Muellerwiebus, Technische Univ. Hamburg-Harburg (Germany)
Hans Joachim Heider, Technische Univ. Hamburg-Harburg (Germany)
Matthias Mahnke, Technische Univ. Hamburg-Harburg (Germany)
Mark Bludszuweit, Technische Univ. Hamburg-Harburg (Germany)
Joerg Mueller, Technische Univ. Hamburg-Harburg (Germany)


Published in SPIE Proceedings Vol. 3952:
Optoelectronic Interconnects VII; Photonics Packaging and Integration II
Michael R. Feldman; Richard Liqiang Li; Michael R. Feldman; Richard Liqiang Li; W. Brian Matkin; Suning Tang, Editor(s)

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