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Proceedings Paper

Hybrid integration of polymer microlens with VCSEL using drop-on-demand technique
Author(s): Yuzo Ishii; Shinji Koike; Yoshimitsu Arai; Yasushiro Ando
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Paper Abstract

Polymer microlens fabrication techniques that enable easy integration with VCSELs are presented. We have developed a high-tolerance coupling structure with microlenses formed on both sides of the optical components for inter-chip optical interconnections, and have developed two types of drop-on- demand techniques for producing microlenses: an ink-jetting method and a dispensing method. Both methods use the surface tension of liquid UV-curable epoxy polymer. We have fabricated various microlenses that have a geometrical diameter from 20 micrometers to over 1 mm with F/1 to F/12 by controlling the volume and viscosity of the droplets and their wettability to the substrate. The measured uniformity in arrayed lenses was within +/- 1 percent in lens diameter and +/- 3 micrometers in pitch. Examples of how we have integrated microlenses with VCSELs are also presented. An ink-jetted microlens ona VCSEL coupled to a single-mode fiber enabled highly efficient coupling: 4 dB greater than without the microlens. A dispensed microlens on a VCSEL coupled to a multimode fiber increased the coupling efficiency by 20 dB compared to without a microlens. In the multimode case, large tolerances of +/- 2 mm in axial misalignment and +/- 10 micrometers in lateral misalignment were obtained for a coupling loss increase of 1 dB.

Paper Details

Date Published: 27 April 2000
PDF: 11 pages
Proc. SPIE 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II, (27 April 2000); doi: 10.1117/12.384419
Show Author Affiliations
Yuzo Ishii, NTT Telecommunications Energy Labs. (Japan)
Shinji Koike, NTT Telecommunications Energy Labs. (Japan)
Yoshimitsu Arai, NTT Telecommunications Energy Labs. (Japan)
Yasushiro Ando, NTT Telecommunications Energy Labs. (Japan)


Published in SPIE Proceedings Vol. 3952:
Optoelectronic Interconnects VII; Photonics Packaging and Integration II
Michael R. Feldman; Richard Liqiang Li; Michael R. Feldman; Richard Liqiang Li; W. Brian Matkin; Suning Tang, Editor(s)

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