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Proceedings Paper

Packaging technology of OptoBGA for 2.4 Gb/s
Author(s): Mitsuo Yanagisawa; Hisayoshi Wada; Seigo Matsuzono; Shingo Sato; Shin Matsuda; Satoshi Ooike; Shigeo Tanahashi; Shoji Uegaki
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Paper Abstract

The significantly increasing transmission capacity in the subscriber system are accelerating demands for higher data transmission speed, low cost, and system miniaturization in the millennium approaches. The key solution for the demands, smaller, lower cost, and high performance package, is surface technology. OptoBGA package has been developed to meet this challenge, a surface mountable type optical package that is designed for high frequency transmission speeds. OptoBGA package has a BGA structure to bring forth effectively size and cost reduction for the packaging. OptoBGA consists of ceramic material, a robust material, which has many advantages such as design flexibility with fine design rule, ease of process technology, high performance, and high reliability. The design of OptoBGA was made possible by improvement in the physical structure. The results of this research produced an OptoBGA with a return loss of about -20dB at 10GHz. Furthermore, reliability test evaluations have been conducted to demonstrate that the OptoBGA can withstand harsh environments.

Paper Details

Date Published: 27 April 2000
PDF: 8 pages
Proc. SPIE 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II, (27 April 2000); doi: 10.1117/12.384416
Show Author Affiliations
Mitsuo Yanagisawa, Kyocera Corp. (Japan)
Hisayoshi Wada, Kyocera Corp. (Japan)
Seigo Matsuzono, Kyocera Corp. (Japan)
Shingo Sato, Kyocera Corp. (Japan)
Shin Matsuda, Kyocera Corp. (Japan)
Satoshi Ooike, Kyocera Corp. (Japan)
Shigeo Tanahashi, Kyocera Corp. (Japan)
Shoji Uegaki, Kyocera Corp. (Japan)

Published in SPIE Proceedings Vol. 3952:
Optoelectronic Interconnects VII; Photonics Packaging and Integration II
Michael R. Feldman; Richard Liqiang Li; Michael R. Feldman; Richard Liqiang Li; W. Brian Matkin; Suning Tang, Editor(s)

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