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Proceedings Paper

Three-dimensional through-wafer fan-out optical interconnects
Author(s): Marion R. LeCompte; Xiao Gao; Harry E. Bates; Jens Meckel; Shouyuan Shi; Dennis W. Prather
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Paper Abstract

As processor speeds rapidly approach the Gigahertz regime, the disparity between process time and memory access time plays an increasing roll in the overall limitation of processor performance. In addition, limitations in interconnect density and bandwidth serve to exacerbate current bottlenecks, particularly as computer architectures continue to reduce in size. To address these issues, we propose a 3D architecture based on through-wafer vertical optical interconnects. To facilitate integration into the current manufacturing infrastructure, our system is monolithically fabricate din the silicon substrate and preserves scale of integration by using meso-scopic diffractive optical elements (DOEs) for beam fan-out. We believe that this architecture can alleviate the disparity between processor speeds and memory access times while increasing interconnect density by at least an order of magnitude. We are current working to demonstrate a prototype system that consists of vertical cavity surface emitting lasers, diffractive optical elements, photodetectors, and memory units integrate don a single silicon substrate. To this end, we are currently refining our fabrication and analysis methods for the realization of meso-scopic DOEs. In this paper, we present our progress to date and demonstrate through-silicon optical data transmission using DOEs that were designed, fabricated, and characterized at the University of Delaware. We present the validation of our theoretical models for the design of such DOEs with experimental data and discuss applications for our proposed architecture including instruction level parallel processors and field programmable gate arrays.

Paper Details

Date Published: 27 April 2000
PDF: 11 pages
Proc. SPIE 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II, (27 April 2000); doi: 10.1117/12.384414
Show Author Affiliations
Marion R. LeCompte, Univ. of Delaware (United States)
Xiao Gao, Univ. of Delaware (United States)
Harry E. Bates, Univ. of Delaware (United States)
Jens Meckel, Univ. of Delaware (United States)
Shouyuan Shi, Univ. of Delaware (United States)
Dennis W. Prather, Univ. of Delaware (United States)


Published in SPIE Proceedings Vol. 3952:
Optoelectronic Interconnects VII; Photonics Packaging and Integration II
Michael R. Feldman; Richard Liqiang Li; Michael R. Feldman; Richard Liqiang Li; W. Brian Matkin; Suning Tang, Editor(s)

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