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Proceedings Paper

High-speed Si MSM photodetector and VCSEL for optoelectronic interconnects
Author(s): Lei Lin; Chulchae Choi; Yujie Liu; Gauri V. Karve; Bipin Bihari; Ray T. Chen
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Paper Abstract

We report the fabrication and processing of thin film MSM silicon photo-detector and thin film VCSEL for optoelectronic interconnects. These two components, together with polyimide wave-guide can be used in constructing the high sped, low power, low cost optical interconnection system. Such a system will provide the fast board level data transmission. The DC and AC characteristics of thin film silicon MSM photo-detector, and the I-V and L-I characteristics of thin film VCSEL are measured.

Paper Details

Date Published: 27 April 2000
PDF: 6 pages
Proc. SPIE 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II, (27 April 2000); doi: 10.1117/12.384413
Show Author Affiliations
Lei Lin, Univ. of Texas/Austin (United States)
Chulchae Choi, Univ. of Texas/Austin (United States)
Yujie Liu, Univ. of Texas/Austin (United States)
Gauri V. Karve, Univ. of Texas/Austin (United States)
Bipin Bihari, Univ. of Texas/Austin (United States)
Ray T. Chen, Univ. of Texas/Austin (United States)


Published in SPIE Proceedings Vol. 3952:
Optoelectronic Interconnects VII; Photonics Packaging and Integration II
Michael R. Feldman; Richard Liqiang Li; Michael R. Feldman; Richard Liqiang Li; W. Brian Matkin; Suning Tang, Editor(s)

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