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Proceedings Paper

Optoelectronic scalable substrates based on film/Z-connection and its application to film optical link module (FOLM)
Author(s): Tetsuzo Yoshimura; James Roman; Yasuhito Takahashi; Michael Lee; Bill Chou; Solomon I. Beilin; Wen-Chou V. Wang; Masaaki Inao
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Paper Abstract

We propose a new concept of optoelectronic (OE) interconnect hardware 'OE Scalable Substrate (OE-SS)' and 'Film Optical Link Module (FOLM)', which have potentiality to remove optics excess. The structure is as follows: OE-films, in which waveguides, thin-film OE devices, LSIs, capacitor chips etc. are integrated with via/pad/electrode, are stacked by electrical joints (Z-connections). This gives rise to standardized-interface capability and scalability. Using one basic technology 'film/Z-connection', all levels of interconnection will be achieved, including massive parallel optical link, inter-board optical connect, and 3D- stack-OE-MCM. We prose a new process 'Device Integration with Self-Organizing Transfer', which is essential for low- cost OE-SS and FOLM, especially for WDM applications.

Paper Details

Date Published: 27 April 2000
PDF: 12 pages
Proc. SPIE 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II, (27 April 2000); doi: 10.1117/12.384398
Show Author Affiliations
Tetsuzo Yoshimura, Fujitsu Computer Packaging Technologies, Inc. (Japan)
James Roman, Fujitsu Computer Packaging Technologies, Inc. (United States)
Yasuhito Takahashi, Fujitsu Computer Packaging Technologies, Inc. (United States)
Michael Lee, Fujitsu Computer Packaging Technologies, Inc. (United States)
Bill Chou, Fujitsu Computer Packaging Technologies, Inc. (United States)
Solomon I. Beilin, Fujitsu Computer Packaging Technologies, Inc. (United States)
Wen-Chou V. Wang, Fujitsu Computer Packaging Technologies, Inc. (United States)
Masaaki Inao, Fujitsu Computer Packaging Technologies, Inc. (United States)


Published in SPIE Proceedings Vol. 3952:
Optoelectronic Interconnects VII; Photonics Packaging and Integration II
Michael R. Feldman; Richard Liqiang Li; Michael R. Feldman; Richard Liqiang Li; W. Brian Matkin; Suning Tang, Editor(s)

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