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Proceedings Paper

Residual thermomechanical stresses in ultrathin chip stack technology
Author(s): J. Puigcorbe; Sergio Leseduarte; Santiago Marco; Eric Beyne; Rita Van Hoof; Antoine Marty; Stephane Pinel; Olivier Vendier; Augustin Coello-Vera
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Paper Abstract

The aim of this work is to analyze the thermo-mechanical stresses evolution produced during the fabrication sequence of the multi-level UTCS structure. Several non-linear material models have been taken into account during the process of modeling. We have therefore resorted to the Finite Element Method for the evaluation of such thermo- mechanical stresses that appears in the manufacturing and stacking process. These efforts are made to optimize the product and process design.

Paper Details

Date Published: 10 April 2000
PDF: 9 pages
Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); doi: 10.1117/12.382329
Show Author Affiliations
J. Puigcorbe, Univ. de Barcelona (Spain)
Sergio Leseduarte, Univ. de Barcelona (Spain)
Santiago Marco, Univ. de Barcelona (Spain)
Eric Beyne, IMEC (Belgium)
Rita Van Hoof, IMEC (Belgium)
Antoine Marty, Lab. d'Analyse et d'Architecture des Systemes (France)
Stephane Pinel, Lab. d.Analyse et d'Architecture des Systemes (France)
Olivier Vendier, Alcatel Space Industries (France)
Augustin Coello-Vera, Alcatel Space Industries (France)


Published in SPIE Proceedings Vol. 4019:
Design, Test, Integration, and Packaging of MEMS/MOEMS
Bernard Courtois; Selden B. Crary; Kaigham J. Gabriel; Jean Michel Karam; Karen W. Markus; Andrew A. O. Tay, Editor(s)

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