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Proceedings Paper

New methodology of work with concurrent engineering in electronic design
Author(s): P. Owezarski; V. Baudin; S. Owezarski; G. Fabre; T. Gayraud; J. M. Dorkel; P. Tounsi
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Paper Abstract

This paper aims at proposing a new enhanced way of working in electronic design. In fact, the design of an electronic component requires many competencies and skills, and the joint effort of several researchers and engineers, not necessarily located a the same lace. With traditional ways of work and communication tools, the interactivity level is reduced and it seems that the product life cycle cannot be improved significantly anymore. As a response, the technological progress in high speed networks and new communication and interaction tools open the way to concurrent engineering. This paper then aims at presenting such way of working, the new functionalities provided to users, and of course the benefits they can gain. As a case study, an actual example in the domain of electronics design illustrates this paper.

Paper Details

Date Published: 10 April 2000
PDF: 8 pages
Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); doi: 10.1117/12.382312
Show Author Affiliations
P. Owezarski, Lab. d'Analyse et d'Architecture des Systemes (France)
V. Baudin, Lab. d'Analyse et d'Architecture des Systemes (France)
S. Owezarski, Lab. d'Analyse et d'Architecture des Systemes (France)
G. Fabre, Lab. d'Analyse et d'Architecture des Systemes (France)
T. Gayraud, Lab. d'Analyse et d'Architecture des Systemes (France)
J. M. Dorkel, Lab. d'Analyse et d'Architecture des Systemes (France)
P. Tounsi, Lab. d'Analyse et d'Architecture des Systemes (France)


Published in SPIE Proceedings Vol. 4019:
Design, Test, Integration, and Packaging of MEMS/MOEMS
Bernard Courtois; Selden B. Crary; Kaigham J. Gabriel; Jean Michel Karam; Karen W. Markus; Andrew A. O. Tay, Editor(s)

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