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Proceedings Paper

Failure of polymer-metal interfaces under hygrothermal loading
Author(s): Andrew A. O. Tay; Y. Ma; Sim Heng Ong
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Paper Abstract

This paper describes a study of the failure of polymer-metal interfaces in plastic-encapsulated IC packages subjected to hygro-thermal loading during solder reflow. All the analyses performed are under plane strain conditions. A finite element fracture mechanics approach was employed to predict the temperature at which a small delamination in the polymer-metal interface of an IC package will propagate. In order to confirm the accuracy of the above prediction, actual package specimens were fabricated and subjected to various levels of moisture preconditions followed by thermal loading at varying temperatures. The specimens were then examined to determine the temperature at which the interface failed. Good agreement was found between numerical prediction and experiment.

Paper Details

Date Published: 10 April 2000
PDF: 11 pages
Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); doi: 10.1117/12.382306
Show Author Affiliations
Andrew A. O. Tay, National Univ. of Singapore (Singapore)
Y. Ma, National Univ. Singapore (Singapore)
Sim Heng Ong, National Semiconductor Manufacturing (Singapore)


Published in SPIE Proceedings Vol. 4019:
Design, Test, Integration, and Packaging of MEMS/MOEMS
Bernard Courtois; Selden B. Crary; Kaigham J. Gabriel; Jean Michel Karam; Karen W. Markus; Andrew A. O. Tay, Editor(s)

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