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Proceedings Paper

Signal processing electronics for a capacitive microsensor
Author(s): Gilles Amendola; Guo Neng Lu
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Paper Abstract

An interface circuit in a 0.8-micrometers CMOS process for the on- chip integration of a capacitive micro-sensor used as a microphone is presented. In order to circumvent 1/f noise contributions and to improve the signal/noise ratio, a synchronous modulation-demodulation technique has been applied. For the implementation of this technique, we have studied and designed several functional block, such as modulator with signal conversion, low-noise amplifier, demodulator, etc. To deal with problems related to dispersion of intrinsic capacitance of the sensor, a feedback compensating solution is suggested. The designed circuit has a sensibility of 1200 V/pF, with a minimum detectable capacitance variation of 2 10-6 pF.

Paper Details

Date Published: 10 April 2000
PDF: 9 pages
Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); doi: 10.1117/12.382282
Show Author Affiliations
Gilles Amendola, Ecole Superieure d'Ingenieurs Electrotechnique et Electronique (France)
Guo Neng Lu, Univ. de Lyon I (France)

Published in SPIE Proceedings Vol. 4019:
Design, Test, Integration, and Packaging of MEMS/MOEMS
Bernard Courtois; Selden B. Crary; Kaigham J. Gabriel; Jean Michel Karam; Karen W. Markus; Andrew A. O. Tay, Editor(s)

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