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Proceedings Paper

High-thermal-impedance beams for suspended MEMS
Author(s): Salvador Mir; Benoit Charlot; F. Parrain; D. Veychard
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Paper Abstract

Suspended thermal MEMS is one of the major domains of application of CMOS-compatible bulk-micro machining technologies. In some applications, a tradeoff much be reached between the mechanical strength of the micro structure and the thermal losses through the support beams. This paper illustrates how suspended MEMS can be strengthened by means of additional support beams which have a very high thermal impedance, thus having a very small impact in the thermal behavior of the micro structure. A high thermal impedance beam can be considered as a new MEMS design cell. The use of this cell in the design of an electro thermal converter with long time constant is illustrated.

Paper Details

Date Published: 10 April 2000
PDF: 9 pages
Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); doi: 10.1117/12.382266
Show Author Affiliations
Salvador Mir, TIMA Lab. (France)
Benoit Charlot, TIMA Lab. (France)
F. Parrain, TIMA Lab. (France)
D. Veychard, TIMA Lab. (France)

Published in SPIE Proceedings Vol. 4019:
Design, Test, Integration, and Packaging of MEMS/MOEMS
Bernard Courtois; Selden B. Crary; Kaigham J. Gabriel; Jean Michel Karam; Karen W. Markus; Andrew A. O. Tay, Editor(s)

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