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Proceedings Paper

Integration and packaging of MEMS relays
Author(s): Jungsang Kim; Cristian A. Bolle; R. A. Boie; John V. Gates; A. G. Ramirez; Sungho Jin; David J. Bishop
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Paper Abstract

Micro machined relays provide switching solutions that are advantageous over existing technology in many aspects of device performance. In order to fully benefit from the MEMS solution n switching, however, a general integration strategy to various integrated circuit electronics needs to be developed. We describe the design and test of such an integration scheme utilizing flip-chip bonding of MEMS relays onto another substrate carrying the remainder of the circuitry. Individual devices consists of cantilever-like mechanical structure carrying a mobile electrode that is electrostatically actuated. The presence of a second substrate in the flip-chip bonded geometry provides the unique possibility of placing electrostatic actuators on both sides of the cantilever, thereby allowing active turn- on and turn-off of the relay device. The fabricated relays show switching time as short as 10 microsecond(s) , actuation voltages as low as 25V, on-state DC resistance as low as 2 (Omega) and open-state DC resistance as large as 1013 (Omega) . The device is assembled and packaged using a single-step flip- chip bonding process. Upon flip-chip bonding, the MEMS devices are completely enclosed in a small cavity between the two substrates that is sealed by a ring-type solder seal. Such techniques provide the opportunity for the integrated chip to be further packaged using conventional cost-effective packaging techniques.

Paper Details

Date Published: 10 April 2000
PDF: 9 pages
Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); doi: 10.1117/12.382263
Show Author Affiliations
Jungsang Kim, Lucent Technologies/Bell Labs. (United States)
Cristian A. Bolle, Lucent Technologies/Bell Labs. (United States)
R. A. Boie, Lucent Technologies/Bell Labs. (United States)
John V. Gates, Lucent Technologies/Bell Labs. (United States)
A. G. Ramirez, Lucent Technologies/Bell Labs. (United States)
Sungho Jin, Lucent Technologies/Bell Labs. (United States)
David J. Bishop, Lucent Technologies/Bell Labs. (United States)


Published in SPIE Proceedings Vol. 4019:
Design, Test, Integration, and Packaging of MEMS/MOEMS
Bernard Courtois; Selden B. Crary; Kaigham J. Gabriel; Jean Michel Karam; Karen W. Markus; Andrew A. O. Tay, Editor(s)

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