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Proceedings Paper

Tolerant low-loss three-lens coupling system for 1.48-um unstable-cavity lasers
Author(s): Francois Boubal; Sylvie Delepine; Paul Salet; Franck Gerard; David Cornec; Michel Di Maggio; Michel Goix; Jean-Pierre Chardon; Emmanuel Grard
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Paper Abstract

A 1.48-micrometer unstable-cavity laser is coupled into a single-mode fiber using three microlenses. Reproducible coupling of very high power is demonstrated with different types of lenses (plano-convex or bi-convex, with different apertures). Over 550 mW in single-mode fiber were reproducibly reached; to our knowledge, it is the highest power coupled into a single-mode fiber from a single semiconductor laser at this wavelength. Tolerance measurements on all of the coupling elements of a three-lens system are reported for the first time; an unexpected very large tolerance on the axial displacement of the second lens was measured. Results and interpretation with the aid of Gaussian and aberration simulations are also presented. Finally, we report on the first realization of a module with 46% chip to fiber coupling efficiency.

Paper Details

Date Published: 29 March 2000
PDF: 8 pages
Proc. SPIE 3945, Laser Diodes and LEDs in Industrial, Measurement, Imaging, and Sensors Applications II; Testing, Packaging, and Reliability of Semiconductor Lasers V, (29 March 2000); doi: 10.1117/12.380543
Show Author Affiliations
Francois Boubal, Alcatel Corporate Research Ctr. (France)
Sylvie Delepine, Alcatel Corporate Research Ctr. (France)
Paul Salet, Alcatel Corporate Research Ctr. (France)
Franck Gerard, Alcatel Corporate Research Ctr. (France)
David Cornec, Alcatel Corporate Research Ctr. (France)
Michel Di Maggio, Alcatel Corporate Research Ctr. (France)
Michel Goix, Alcatel Corporate Research Ctr. (France)
Jean-Pierre Chardon, Alcatel Corporate Research Ctr. (France)
Emmanuel Grard, Alcatel Corporate Research Ctr. (France)


Published in SPIE Proceedings Vol. 3945:
Laser Diodes and LEDs in Industrial, Measurement, Imaging, and Sensors Applications II; Testing, Packaging, and Reliability of Semiconductor Lasers V
Geoffrey T. Burnham; S. C. Wang; Geoffrey T. Burnham; Xiaoguang He; Kurt J. Linden; S. C. Wang, Editor(s)

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