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Proceedings Paper

Accuracy enhancement of point triangulation probes for linear displacement measurement
Author(s): Kyung-Chan Kim; Jong-Ahn Kim; SeBaek Oh; Soo Hyun Kim; Yoon Keun Kwak
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Paper Abstract

Point triangulation probes (PTBs) fall into a general category of noncontact height or displacement measurement devices. PTBs are widely used for their simple structure, high resolution, and long operating range. However, there are several factors that must be taken into account in order to obtain high accuracy and reliability; measurement errors from inclinations of an object surface, probe signal fluctuations generated by speckle effects, power variation of a light source, electronic noises, and so on. In this paper, we propose a novel signal processing algorithm, named as EASDF (expanded average square difference function), for a newly designed PTB which is composed of an incoherent source (LED), a line scan array detector, a specially selected diffuse reflecting surface, and several optical components. The EASDF, which is a modified correlation function, is able to calculate displacement between the probe and the object surface effectively even if there are inclinations, power fluctuations, and noises.

Paper Details

Date Published: 29 March 2000
PDF: 8 pages
Proc. SPIE 3945, Laser Diodes and LEDs in Industrial, Measurement, Imaging, and Sensors Applications II; Testing, Packaging, and Reliability of Semiconductor Lasers V, (29 March 2000); doi: 10.1117/12.380524
Show Author Affiliations
Kyung-Chan Kim, Korea Advanced Institute of Science and Technology (South Korea)
Jong-Ahn Kim, Korea Advanced Institute of Science and Technology (South Korea)
SeBaek Oh, Korea Advanced Institute of Science and Technology (South Korea)
Soo Hyun Kim, Korea Advanced Institute of Science and Technology (South Korea)
Yoon Keun Kwak, Korea Advanced Institute of Science and Technology (South Korea)


Published in SPIE Proceedings Vol. 3945:
Laser Diodes and LEDs in Industrial, Measurement, Imaging, and Sensors Applications II; Testing, Packaging, and Reliability of Semiconductor Lasers V
Geoffrey T. Burnham; S. C. Wang; Geoffrey T. Burnham; Xiaoguang He; Kurt J. Linden; S. C. Wang, Editor(s)

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