Share Email Print
cover

Proceedings Paper

Innovative approach for concurrent CD-uniformity monitoring and reticle inspection
Author(s): Amikam Sade; Juergen Fandrich; Shirley Hemar; Yair Eran
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

In this paper a new approach of concurrent CD-uniformity monitoring is presented. This is achieved by using the Linewidth Bias Monitoring (LBM) tool, which utilizes data collected during the reticle inspection to concurrently generate real-time line width monitoring with superb precision without affecting inspection time or results. The capabilities of the LBM are presented by a specially designed test-plate, establishing the tool precision and repeatability. Analysis of case studies based on various production plates demonstrates the contribution to process control and mask fidelity.

Paper Details

Date Published: 3 February 2000
PDF: 13 pages
Proc. SPIE 3996, 16th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (3 February 2000); doi: 10.1117/12.377108
Show Author Affiliations
Amikam Sade, Applied Materials (Israel)
Juergen Fandrich, Applied Materials (Germany)
Shirley Hemar, Applied Materials (Israel)
Yair Eran, Applied Materials (Israel)


Published in SPIE Proceedings Vol. 3996:
16th European Conference on Mask Technology for Integrated Circuits and Microcomponents
Uwe F. W. Behringer, Editor(s)

© SPIE. Terms of Use
Back to Top