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Proceedings Paper

Layout postprocessing in ion projection lithography (IPL)
Author(s): Hans Hartmann; Alex Petraschenko; Stefan Schunk; Richard Steinmetz; Ernst Haugeneder; Hans Loeschner
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Paper Abstract

Several post-optical lithography technologies are under development. Ion proj ecti on lithography (IPL) is one choice. For the industrial usage of the ion projection lithography a powerful software tool for layout post processing is necessary to achieve the required (TI) uniformity and pattern fidelity. The application of stencil masks in the IPL exposure step requires the concept of complementary masks. The IPL software has to provide the mask pattern split and the complementary mask layout as well as a mask pattern pre-distortion in order to compensate ion optical and membrane stress induced pattern distortions. The IPL specific pattern transfer process shows fig. I. The goal of this figure is to achieve a correspondence between chip layout on design level and wafer layout.

Paper Details

Date Published: 3 February 2000
PDF: 3 pages
Proc. SPIE 3996, 16th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (3 February 2000); doi: 10.1117/12.377097
Show Author Affiliations
Hans Hartmann, aiss GmbH (Germany)
Alex Petraschenko, aiss GmbH (Germany)
Stefan Schunk, aiss GmbH (Germany)
Richard Steinmetz, aiss GmbH (Germany)
Ernst Haugeneder, Ion Microfabrications Systems (Austria)
Hans Loeschner, Ion Microfabrications Systems (Austria)


Published in SPIE Proceedings Vol. 3996:
16th European Conference on Mask Technology for Integrated Circuits and Microcomponents
Uwe F. W. Behringer, Editor(s)

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